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MLG1005S0N6CTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S0N6CTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S0N6CTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005S0N6CTD25 Details

  • Manufacturer Part Number:

    MLG1005S0N6CTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.75

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    0.0006 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Current-Max:

    1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    10000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.2NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    0.33%

MLG1005S0N6CTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S0N6CTD25 is a rectangular pad with a size of 1.2mm x 1.4mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • To handle the MLG1005S0N6CTD25's sensitivity to temperature during reflow soldering, it is recommended to follow a temperature profile with a peak temperature of 260°C or less, and a dwell time of 30 seconds or less. This will help prevent thermal damage to the inductor.
  • While the MLG1005S0N6CTD25 is designed for high-frequency applications, its performance may degrade above 100 MHz. It is recommended to consult with TDK Corporation or perform simulations to determine the inductor's suitability for your specific high-frequency application.
  • To ensure the MLG1005S0N6CTD25 is properly secured to the PCB, it is recommended to use a sufficient amount of solder paste and to follow a proper reflow soldering process. Additionally, consider using a mechanical fastening method, such as a clamp or adhesive, to further secure the inductor to the PCB.
  • The expected lifespan of the MLG1005S0N6CTD25 depends on various factors, including operating conditions, temperature, and humidity. However, TDK Corporation typically specifies a lifespan of 10 to 20 years or more, depending on the specific application and environmental conditions.

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MLG1005S0N6CTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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