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MLG1005S11NHT000 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S11NHT000 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S11NHT000 - TDK  - 3D model - Other - MLG1005
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MLG1005S11NHT000 Details

  • Manufacturer Part Number:

    MLG1005S11NHT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.4 Ω

  • Inductance-Nom (L):

    0.011 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.4 A

  • Self Resonance Frequency:

    2500 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    3%

MLG1005S11NHT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S11NHT000 is a rectangular pad with a size of 1.1mm x 0.9mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • The MLG1005S11NHT000 should be stored in a dry, cool place, away from direct sunlight and moisture. It is recommended to store the components in their original packaging or in a sealed bag to prevent damage. When handling the components, it is recommended to use anti-static wrist straps or mats to prevent electrostatic discharge (ESD) damage.
  • The maximum operating temperature range for the MLG1005S11NHT000 is -40°C to +125°C. However, it is recommended to operate the component within the specified temperature range to ensure optimal performance and reliability.
  • Yes, the MLG1005S11NHT000 is suitable for high-frequency applications up to 1 GHz. However, it is recommended to consult the datasheet and perform simulations to ensure that the component meets the specific requirements of your application.
  • The MLG1005S11NHT000 can be soldered using a reflow soldering process with a peak temperature of 260°C. It is recommended to use a solder paste with a melting point of 217°C to 220°C. The component should be placed on a solder land with a thickness of 0.05mm to 0.15mm.

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MLG1005S11NHT000 Overview

Use the download button to access the MLG1005S11NHT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLG1005S11NHTD25 TDK Corporation

General Purpose Inductor, 0.011uH, 3%, 1 Element, Ceramic-Core, SMD, 0402

Part Image MLG1005S11NHT TDK Corporation

General Purpose Inductor, 0.011uH, 3%, 1 Element, Ceramic-Core, SMD, 0402