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MLG1005S1N3CTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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MLG1005S1N3CTD25 - TDK - PCB symbol
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PCB Footprints
MLG1005S1N3CTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S1N3CTD25 - TDK - 3D model - Other - MLG1005
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MLG1005S1N3CTD25 Details

  • Manufacturer Part Number:

    MLG1005S1N3CTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.75

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    0.0013 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    7

  • Rated Current-Max:

    1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    8000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.2NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    0.15%

MLG1005S1N3CTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S1N3CTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 0.8mm and a thickness of 0.035mm.
  • The MLG1005S1N3CTD25 should be stored in a dry, clean environment away from direct sunlight and moisture. During shipping, it should be packaged in a way that prevents mechanical stress and damage. TDK Corporation may provide specific guidelines for handling and storage in their documentation.
  • The thermal derating curve for the MLG1005S1N3CTD25 can be obtained from TDK Corporation's application note or by contacting their technical support. It typically shows the reduction in inductance and current rating as a function of temperature.
  • The MLG1005S1N3CTD25 is designed for high-frequency applications, but its performance may degrade above a certain frequency. TDK Corporation may provide guidance on the maximum operating frequency and any necessary design considerations in their documentation or application notes.
  • The MLG1005S1N3CTD25 should be soldered using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The soldering process should be done in a way that prevents thermal shock and mechanical stress to the component.

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MLG1005S1N3CTD25 Overview

Use the download button to access the MLG1005S1N3CTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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MLG1005S1N3CTD25 Alternates

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Part Image MLG1005S1N3STD25 TDK Corporation

General Purpose Inductor, 0.0013uH, 0.23%, 1 Element, Ceramic-Core, SMD, 0402