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MLG1005S27NHTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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MLG1005S27NHTD25 - TDK - PCB symbol
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PCB Footprints
MLG1005S27NHTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S27NHTD25 - TDK - 3D model - Other - MLG1005
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MLG1005S27NHTD25 Details

  • Manufacturer Part Number:

    MLG1005S27NHTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.8 Ω

  • Inductance-Nom (L):

    0.027 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.3 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    1600 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    3%

MLG1005S27NHTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S27NHTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 0.8mm and a thermal via to ensure good thermal dissipation.
  • The MLG1005S27NHTD25 is a moisture-sensitive device. To handle it, follow the standard moisture-sensitive device handling procedures, such as storing it in a dry environment, using a dry pack or nitrogen-filled packaging, and baking it before reflow soldering if it has been exposed to moisture.
  • The maximum reflow temperature for the MLG1005S27NHTD25 is 260°C, as specified in the datasheet. Exceeding this temperature may damage the component or affect its performance.
  • The MLG1005S27NHTD25 is designed to withstand normal vibration levels, but it may not be suitable for extremely high-vibration environments. If your application involves high vibration, consider using a more robust inductor or consulting with TDK Corporation's application engineers for guidance.
  • To minimize magnetic field interference, follow good PCB design practices, such as keeping the MLG1005S27NHTD25 away from sensitive components, using shielding, and orienting the inductor to minimize its magnetic field effects on nearby components.

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MLG1005S27NHTD25 Overview

Use the download button to access the MLG1005S27NHTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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MLG1005S27NHTD25 Alternates

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Part Image MLG1005S27NHT000 TDK Corporation

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For a full list of alternate parts for MLG1005S27NHTD25, check out Findchips.com