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MLG1005S2N4BTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S2N4BTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S2N4BTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005S2N4BTD25 Details

  • Manufacturer Part Number:

    MLG1005S2N4BTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.15 Ω

  • Inductance-Nom (L):

    0.0024 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    7

  • Rated Current-Max:

    0.8 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    7000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.1NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    0.04%

MLG1005S2N4BTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S2N4BTD25 can be found in the TDK Corporation's application note or footprint library. It is essential to follow the recommended land pattern to ensure proper mounting and to prevent soldering issues.
  • Handle the MLG1005S2N4BTD25 by the edges or the body, avoiding touching the terminals or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The maximum reflow temperature for the MLG1005S2N4BTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • The MLG1005S2N4BTD25 is designed to withstand certain levels of vibration, but it's essential to evaluate the component's performance in your specific application. Consult with TDK Corporation or a qualified engineer to determine the suitability of the component for your high-vibration environment.
  • Store the MLG1005S2N4BTD25 in its original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the component to moisture, extreme temperatures, or physical stress. Follow the storage guidelines provided by TDK Corporation or industry standards to maintain the component's shelf life.

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MLG1005S2N4BTD25 Overview

Use the download button to access the MLG1005S2N4BTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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