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MLG1005S2N4ST000 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S2N4ST000 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S2N4ST000 - TDK  - 3D model - Other - MLG1005
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MLG1005S2N4ST000 Details

  • Manufacturer Part Number:

    MLG1005S2N4ST000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.15 Ω

  • Inductance-Nom (L):

    0.0024 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    7

  • Rated Current-Max:

    0.8 A

  • Self Resonance Frequency:

    7000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    12.5%

MLG1005S2N4ST000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S2N4ST000 can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • The MLG1005S2N4ST000 is a moisture-sensitive device, and it requires special handling and storage to prevent damage. It is recommended to store the components in a dry environment with a relative humidity of 10% or less, and to follow the recommended baking and drying procedures before reflow soldering.
  • The maximum reflow temperature for the MLG1005S2N4ST000 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. Exceeding this temperature can cause damage to the component or affect its performance and reliability.
  • The MLG1005S2N4ST000 is designed to operate in a variety of environments, including those with high vibration. However, it is recommended to follow the recommended mounting and soldering procedures to ensure that the component is securely attached to the PCB and can withstand the expected vibration levels.
  • To troubleshoot issues with the MLG1005S2N4ST000, it is recommended to follow a systematic approach, starting with visual inspection of the component and PCB, followed by electrical testing and measurement of the component's parameters. TDK Corporation's application notes and technical support resources can also provide valuable guidance and assistance.

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MLG1005S2N4ST000 Overview

Use the download button to access the MLG1005S2N4ST000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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