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MLG1005S3N3BTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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Symbol
MLG1005S3N3BTD25 - TDK - PCB symbol
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PCB Footprints
MLG1005S3N3BTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S3N3BTD25 - TDK - 3D model - Other - MLG1005
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MLG1005S3N3BTD25 Details

  • Manufacturer Part Number:

    MLG1005S3N3BTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.2 Ω

  • Inductance-Nom (L):

    0.0033 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.8 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    5000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.1NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    0.03%

MLG1005S3N3BTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S3N3BTD25 can be found in the TDK Corporation's recommended footprint document or by contacting their technical support. The land pattern should be designed to ensure good solderability and thermal dissipation.
  • Handle the MLG1005S3N3BTD25 by the edges or the recommended handling areas to prevent damage to the component. Avoid touching the component's terminals or body to prevent electrostatic discharge (ESD) damage. Use ESD-safe materials and equipment during assembly.
  • The maximum reflow temperature for the MLG1005S3N3BTD25 is typically 260°C, but it's recommended to follow the specific reflow profile recommended by TDK Corporation or the assembly house to ensure reliable soldering and prevent damage to the component.
  • The MLG1005S3N3BTD25 is designed to be used in a variety of environments, including those with vibration. However, it's recommended to evaluate the component's performance in the specific vibration environment and consider additional mechanical support or fixation if necessary.
  • To troubleshoot issues with the MLG1005S3N3BTD25, follow a systematic approach to identify the root cause of the problem. Check the component's datasheet, application notes, and technical support resources from TDK Corporation. Perform visual inspections, electrical measurements, and environmental tests to isolate the issue.

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MLG1005S3N3BTD25 Overview

Use the download button to access the MLG1005S3N3BTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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