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MLG1005S6N2STD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S6N2STD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S6N2STD25 - TDK  - 3D model - Other - MLG1005
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MLG1005S6N2STD25 Details

  • Manufacturer Part Number:

    MLG1005S6N2STD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.25 Ω

  • Inductance-Nom (L):

    0.0062 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.6 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    4000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.3NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    0.05%

MLG1005S6N2STD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG1005S6N2STD25 can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The MLG1005S6N2STD25 is a moisture-sensitive device and should be handled according to the JEDEC J-STD-033 standard. This means that the component should be stored in a dry environment, and exposure to moisture should be minimized during handling and assembly. Baking the component before reflow soldering may also be necessary to prevent moisture-related defects.
  • The maximum reflow temperature for MLG1005S6N2STD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its performance and reliability.
  • The MLG1005S6N2STD25 is designed to meet the requirements of various industries, including automotive and industrial, which often involve high-vibration environments. However, it's essential to evaluate the component's performance and reliability in the specific application and environment. TDK Corporation may also provide additional information or guidance on using the component in high-vibration environments.
  • Troubleshooting issues with the MLG1005S6N2STD25 typically involves a combination of visual inspection, electrical testing, and analysis of the application circuit. TDK Corporation may also provide application notes, FAQs, or technical support to help diagnose and resolve issues with the component.

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MLG1005S6N2STD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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