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MLG1005S6N8HTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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MLG1005S6N8HTD25 - TDK - PCB symbol
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PCB Footprints
MLG1005S6N8HTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S6N8HTD25 - TDK - 3D model - Other - MLG1005
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MLG1005S6N8HTD25 Details

  • Manufacturer Part Number:

    MLG1005S6N8HTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.25 Ω

  • Inductance-Nom (L):

    0.0068 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.6 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    3500 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    3%

MLG1005S6N8HTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG1005S6N8HTD25 is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
  • During reflow soldering, the MLG1005S6N8HTD25 should be placed on the PCB with the component markings facing upwards. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. The component should be handled with care to avoid mechanical stress and damage.
  • The MLG1005S6N8HTD25 is designed to withstand moderate vibration levels, but it's not recommended for high-vibration environments. If your application requires high vibration resistance, consider using a different component or consulting with TDK Corporation for custom solutions.
  • The MLG1005S6N8HTD25 is rated for operation up to 125°C, but its performance may degrade above 100°C. If your application requires high-temperature operation, consider using a different component or consulting with TDK Corporation for custom solutions.
  • The MLG1005S6N8HTD25 is designed to operate in a relative humidity range of 40% to 80%. However, it's not recommended for use in extremely humid environments. If your application requires operation in high-humidity conditions, consider using a different component or consulting with TDK Corporation for custom solutions.

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MLG1005S6N8HTD25 Overview

Use the download button to access the MLG1005S6N8HTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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For a full list of alternate parts for MLG1005S6N8HTD25, check out Findchips.com