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MLG1005SR30JTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005SR30JTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005SR30JTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005SR30JTD25 Details

  • Manufacturer Part Number:

    MLG1005SR30JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    6.5 Ω

  • Inductance-Nom (L):

    0.3 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    6

  • Rated Current-Max:

    0.05 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    350 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    50 MHz

  • Tolerance:

    5%

MLG1005SR30JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005SR30JTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 0.8mm and a thermal via to ensure good thermal dissipation.
  • The MLG1005SR30JTD25 is a moisture-sensitive device. To handle it, follow the standard moisture-sensitive device handling procedures, such as storing it in a dry environment, using a dry pack or nitrogen-filled packaging, and baking the component before reflow soldering if it has been exposed to moisture.
  • The maximum operating temperature range for the MLG1005SR30JTD25 is -40°C to +125°C. However, the inductor's characteristics, such as inductance and Q factor, may vary outside the recommended operating temperature range of -20°C to +85°C.
  • While the MLG1005SR30JTD25 is designed for high-frequency applications, its performance may degrade above 100 MHz. TDK Corporation recommends using their high-frequency inductor series, such as the MLG1608SR or MLG2010SR, for applications above 100 MHz.
  • To ensure proper soldering, follow the recommended reflow soldering profile, use a solder paste with a melting point below 220°C, and avoid applying excessive heat or pressure to the component. Also, inspect the solder joints for any defects or cold solder joints.

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MLG1005SR30JTD25 Overview

Use the download button to access the MLG1005SR30JTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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