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MLG1005SR33HTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005SR33HTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005SR33HTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005SR33HTD25 Details

  • Manufacturer Part Number:

    MLG1005SR33HTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    7 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    6

  • Rated Current-Max:

    0.05 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    350 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    50 MHz

  • Tolerance:

    3%

MLG1005SR33HTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005SR33HTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.25mm x 1.25mm and a thermal pad with a size of 1.5mm x 1.5mm.
  • The MLG1005SR33HTD25 should be stored in a dry, clean environment away from direct sunlight and moisture. During shipping, it should be packaged in a way that prevents mechanical stress and damage. TDK Corporation may provide specific guidelines for handling and storage in their documentation or on their website.
  • The maximum operating temperature range for the MLG1005SR33HTD25 is typically -40°C to +125°C, but this may vary depending on the specific application and environment. It's essential to check the datasheet and consult with TDK Corporation if you have any doubts.
  • The MLG1005SR33HTD25 is designed to withstand certain levels of vibration, but it's essential to check the specific vibration requirements of your application and consult with TDK Corporation to ensure the inductor can meet those requirements.
  • The MLG1005SR33HTD25 should be soldered using a reflow soldering process with a peak temperature of 260°C or less. It's essential to follow the recommended soldering profile and guidelines provided by TDK Corporation to ensure reliable connections and prevent damage to the component.

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MLG1005SR33HTD25 Overview

Use the download button to access the MLG1005SR33HTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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General Purpose Inductor, 0.33uH, 3%, 1 Element, Ceramic-Core, SMD, 0402