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MLG1608B1N2STD25 - TDK

Description: Unshielded Multilayer Inductor 0603 (1608 Metric)

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PCB Footprints
MLG1608B1N2STD25 - TDK PCB footprint - Other - Other - MLG1608
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MLG1608B1N2STD25 - TDK  - 3D model - Other - MLG1608
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MLG1608B1N2STD25 Details

  • Manufacturer Part Number:

    MLG1608B1N2STD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    0.0012 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.6 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    10000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    25%

MLG1608B1N2STD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG1608B1N2STD25 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • The MLG1608B1N2STD25 is rated for operation up to 125°C, but it's recommended to derate the component's specifications according to the temperature derating curve provided in the datasheet. Additionally, ensure that the component is properly soldered and the PCB is designed to handle high temperatures.
  • Handle the MLG1608B1N2STD25 by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Ensure that the component is properly seated and soldered to prevent mechanical stress.
  • The MLG1608B1N2STD25 is designed to withstand moderate vibration levels, but it's recommended to ensure that the PCB is properly secured and the component is properly soldered to prevent mechanical stress. Additionally, consider using a vibration-resistant mounting method, such as a screw-down or adhesive mounting, to secure the PCB.
  • The ESR of the MLG1608B1N2STD25 can be determined by measuring the impedance of the component at high frequencies (e.g., 100 kHz to 1 MHz) using an impedance analyzer or a network analyzer. The ESR can also be estimated using the component's datasheet specifications and the following formula: ESR = (ESL / (2 * π * f * C)), where ESL is the equivalent series inductance, f is the frequency, and C is the capacitance.

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MLG1608B1N2STD25 Overview

Use the download button to access the MLG1608B1N2STD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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