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MLG1608B1N5ST000 - TDK

Description: Unshielded Multilayer Inductor 0603 (1608 Metric)

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Symbol
MLG1608B1N5ST000 - TDK - PCB symbol
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PCB Footprints
MLG1608B1N5ST000 - TDK PCB footprint - Other - Other - MLG1608
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3D Models
MLG1608B1N5ST000 - TDK - 3D model - Other - MLG1608
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MLG1608B1N5ST000 Details

  • Manufacturer Part Number:

    MLG1608B1N5ST000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP, 1608, ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    1608

  • Construction:

    Multilayer Chip

  • Core Material:

    FERRITE

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    0.0015 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.6 A

  • Self Resonance Frequency:

    10000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    INDUCTANCE TOLERANCE IS 0.3 NANO HENRY

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    20%

MLG1608B1N5ST000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG1608B1N5ST000 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure good solderability and to prevent solder bridging.
  • The MLG1608B1N5ST000 is rated for operation up to 125°C, but it's not recommended to use it in extreme high-temperature environments (above 150°C) as it may affect the component's reliability and lifespan.
  • Handle the MLG1608B1N5ST000 by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage.
  • The MLG1608B1N5ST000 is designed to withstand moderate vibration levels, but it's recommended to follow TDK's guidelines for vibration testing and to ensure proper mounting and soldering to prevent component detachment or damage.
  • The recommended soldering profile for MLG1608B1N5ST000 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Avoid using excessive soldering temperatures or times to prevent component damage.

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MLG1608B1N5ST000 Overview

Use the download button to access the MLG1608B1N5ST000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG16, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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