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MLG1608B1N5STD25 - TDK

Description: Unshielded Multilayer Inductor 0603 (1608 Metric)

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MLG1608B1N5STD25 - TDK - PCB symbol
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PCB Footprints
MLG1608B1N5STD25 - TDK PCB footprint - Other - Other - MLG1608
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3D Models
MLG1608B1N5STD25 - TDK - 3D model - Other - MLG1608
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MLG1608B1N5STD25 Details

  • Manufacturer Part Number:

    MLG1608B1N5STD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    0.0015 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.6 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    10000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    20%

MLG1608B1N5STD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG1608B1N5STD25 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the MLG1608B1N5STD25 should be placed on a flat surface to prevent warpage. The component should be exposed to a peak temperature of 260°C for no more than 30 seconds, and the temperature should be ramped up and down at a rate of 3°C/second or less.
  • Yes, the MLG1608B1N5STD25 is compatible with lead-free soldering. TDK Corporation recommends using a lead-free solder alloy with a melting point of 217°C or higher.
  • The maximum operating temperature range for the MLG1608B1N5STD25 is -40°C to 125°C. However, the component's performance may degrade at temperatures above 85°C.
  • The MLG1608B1N5STD25 should be stored in a dry, cool place with a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.

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MLG1608B1N5STD25 Overview

Use the download button to access the MLG1608B1N5STD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG16, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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