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MLG1608B22NJTD25 - TDK

Description: Unshielded Multilayer Inductor 0603 (1608 Metric)

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PCB Footprints
MLG1608B22NJTD25 - TDK PCB footprint - Other - Other - MLG1608
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MLG1608B22NJTD25 - TDK  - 3D model - Other - MLG1608
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MLG1608B22NJTD25 Details

  • Manufacturer Part Number:

    MLG1608B22NJTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.35 Ω

  • Inductance-Nom (L):

    0.022 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    12

  • Rated Current-Max:

    0.5 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    2300 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

MLG1608B22NJTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1608B22NJTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.6mm x 0.8mm and a thickness of 0.3mm.
  • The MLG1608B22NJTD25 should be stored in a dry, cool place away from direct sunlight and moisture. During shipping, it should be packaged in a way that prevents mechanical stress and damage. TDK Corporation may provide specific guidelines for handling and storage in their documentation.
  • The maximum operating temperature range for the MLG1608B22NJTD25 is typically -40°C to +125°C, but this may vary depending on the specific application and environment. It's recommended to consult the datasheet and application notes for more information.
  • The MLG1608B22NJTD25 can be soldered using a reflow soldering process with a peak temperature of 260°C. It's recommended to use a solder with a melting point of 220°C or higher and to follow the recommended soldering profile provided by TDK Corporation.
  • The equivalent series resistance (ESR) of the MLG1608B22NJTD25 is typically around 0.2 ohms, but this may vary depending on the frequency and operating conditions. It's recommended to consult the datasheet and application notes for more information.

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MLG1608B22NJTD25 Overview

Use the download button to access the MLG1608B22NJTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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For a full list of alternate parts for MLG1608B22NJTD25, check out Findchips.com