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MLG1608SR33JT000 - TDK

Description: Unshielded Multilayer Inductor 0603 (1608 Metric)

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Symbol
MLG1608SR33JT000 - TDK - PCB symbol
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PCB Footprints
MLG1608SR33JT000 - TDK PCB footprint - Other - Other - MLG1608
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3D Models
MLG1608SR33JT000 - TDK - 3D model - Other - MLG1608
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MLG1608SR33JT000 Details

  • Manufacturer Part Number:

    MLG1608SR33JT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP, 1608, ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    1608

  • Construction:

    Multilayer Chip

  • Core Material:

    FERRITE

  • DC Resistance:

    2.8 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    0.1 A

  • Self Resonance Frequency:

    350 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    50 MHz

  • Tolerance:

    5%

MLG1608SR33JT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1608SR33JT000 is a rectangular pad with a size of 1.6mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.2mm from the component body.
  • The MLG1608SR33JT000 is a reflow-solderable component. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. The component should be placed on a solder paste layer with a thickness of 0.1-0.2mm.
  • The maximum current rating for the MLG1608SR33JT000 is 1.3A, based on a temperature rise of 40°C. However, the actual current rating may be lower depending on the specific application and operating conditions.
  • Yes, the MLG1608SR33JT000 is compatible with lead-free soldering. The component is RoHS-compliant and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • The ESR of the MLG1608SR33JT000 is approximately 0.35 ohms at 100MHz. However, the actual ESR may vary depending on the frequency and operating conditions.

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MLG1608SR33JT000 Overview

Use the download button to access the MLG1608SR33JT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG16, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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