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MLJ1608WR33KT000 - TDK

Description: SMD / SMT Inductors (Coils), L=330nH, L x W x T :

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PCB Footprints
MLJ1608WR33KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLJ1608
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3D Models
MLJ1608WR33KT000 - TDK  - 3D model - Inductors Chip - MLJ1608
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MLJ1608WR33KT000 Details

  • Manufacturer Part Number:

    MLJ1608WR33KT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.32 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    0.5 A

  • Self Resonance Frequency:

    230 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    10%

MLJ1608WR33KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLJ1608WR33KT000 can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The MLJ1608WR33KT000 is a moisture-sensitive device and should be handled according to the IPC/JEDEC J-STD-033 standard. This includes storing the components in a dry environment, using a dry pack or nitrogen-filled packaging, and following proper baking procedures before reflow soldering.
  • The maximum reflow temperature for MLJ1608WR33KT000 is 260°C, as specified in the datasheet. However, it's recommended to follow the recommended reflow profile provided by TDK Corporation or a qualified reflow soldering expert to ensure optimal performance and reliability.
  • The MLJ1608WR33KT000 is designed to meet the requirements of various industries, including automotive and industrial applications. However, it's essential to evaluate the component's performance under vibration conditions specific to your application. TDK Corporation may provide additional information or support to help you assess the component's suitability for your specific use case.
  • To troubleshoot issues with the MLJ1608WR33KT000, start by reviewing the datasheet and application notes provided by TDK Corporation. Check for proper component orientation, soldering, and PCB design. If the issue persists, contact TDK Corporation's customer support or a qualified engineer for further assistance and guidance.

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MLJ1608WR33KT000 Overview

Use the download button to access the MLJ1608WR33KT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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