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MLP2012S3R3MT0S1 - TDK

Description: Inductor Power Shielded Multi-Layer 3.3uH 20% 2MHz Ferrite 900mA 247mOhm DCR 0805 T/R

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Symbol
MLP2012S3R3MT0S1 - TDK - PCB symbol
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PCB Footprints
MLP2012S3R3MT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - 0805 (2012 metric)--2
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3D Models
MLP2012S3R3MT0S1 - TDK - 3D model - Inductors Chip - 0805 (2012 metric)--2
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MLP2012S3R3MT0S1 Details

  • Manufacturer Part Number:

    MLP2012S3R3MT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.19 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Current-Max:

    0.9 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2012S3R3MT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLP2012S3R3MT0S1 can be found in the TDK Corporation's application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, handle the MLP2012S3R3MT0S1 by the edges, avoid touching the pins, and use an anti-static wrist strap or mat. Also, ensure that the assembly area is clean and free from debris.
  • The maximum reflow temperature for the MLP2012S3R3MT0S1 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component.
  • The MLP2012S3R3MT0S1 is designed to withstand moderate vibration. However, it's essential to evaluate the component's performance in your specific application and consider additional mechanical support or potting if the vibration levels are extreme.
  • Store the MLP2012S3R3MT0S1 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid exposing the component to electrostatic discharge, and ensure that the storage area is clean and dry.

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MLP2012S3R3MT0S1 Overview

Use the download button to access the MLP2012S3R3MT0S1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLP20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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