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MLP2016S1R0MT0S1 - TDK

Description: Inductor Power Shielded Multi-Layer 1uH 20% 2MHz Ferrite 1.4A 117mOhm DCR 0806 T/R

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MLP2016S1R0MT0S1 - TDK - PCB symbol
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PCB Footprints
MLP2016S1R0MT0S1 - TDK PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - MLP2016S1R0MT0S1
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MLP2016S1R0MT0S1 - TDK - 3D model - Capacitor Chip Non-polarised - MLP2016S1R0MT0S1
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MLP2016S1R0MT0S1 Details

  • Manufacturer Part Number:

    MLP2016S1R0MT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    0806

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.09 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    1.4 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2016S1R0MT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLP2016S1R0MT0S1 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • During reflow soldering, the MLP2016S1R0MT0S1 should be exposed to a peak temperature of 260°C for no more than 10 seconds. The recommended reflow profile is a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s.
  • Yes, the MLP2016S1R0MT0S1 is compatible with lead-free soldering. It is designed to withstand the higher temperatures required for lead-free soldering processes.
  • The MLP2016S1R0MT0S1 has a moisture sensitivity level (MSL) of 3, which means it can withstand exposure to moisture for up to 168 hours without being baked prior to reflow soldering.
  • Yes, the MLP2016S1R0MT0S1 is designed for high-frequency applications up to 6 GHz. It has a low equivalent series resistance (ESR) and a high self-resonant frequency, making it suitable for use in high-frequency circuits.

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MLP2016S1R0MT0S1 Overview

Use the download button to access the MLP2016S1R0MT0S1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLP20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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