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MLX90363KDC-ABB-000-RE - Melexis

Description: Board Mount Hall Effect / Magnetic Sensors Triaxis Programmable Rotary, Linear & 3D Position Sensor feat. SPI Protocol (Gen. II)

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MLX90363KDC-ABB-000-RE - Melexis PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8
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MLX90363KDC-ABB-000-RE - Melexis  - 3D model - Small Outline Packages - SOIC-8
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MLX90363KDC-ABB-000-RE Details

  • Manufacturer Part Number:

    MLX90363KDC-ABB-000-RE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Melexis Microelectronic Integrated Systems

  • YTEOL:

    7

  • Additional Feature:

    IT ALSO REQUIRES 5V NOMINAL SUPPLY VOLTAGE

  • Body Breadth:

    3.9 mm

  • Body Height:

    1.47 mm

  • Body Length or Diameter:

    4.89 mm

  • Housing:

    PLASTIC

  • Magnetic Field Range-Max:

    70 mT

  • Magnetic Field Range-Min:

    20 mT

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    8

  • Operating Current-Max:

    18 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    SPI

  • Output Range:

    0.4-2.9V

  • Output Type:

    DIGITAL VOLTAGE

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape/Style:

    RECTANGULAR

  • Packing Method:

    TR

  • Screening Level:

    TS 16949

  • Sensors/Transducers Type:

    MAGNETIC FIELD SENSOR,HALL EFFECT

  • Supply Voltage-Max:

    3.45 V

  • Supply Voltage-Min:

    3.15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Termination Type:

    SOLDER

MLX90363KDC-ABB-000-RE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and a solid ground connection to the device's GND pin is recommended. Additionally, keep the analog and digital traces separate and avoid running them parallel to each other.
  • Ensure good thermal coupling between the device and the target surface. Use a thermally conductive adhesive or thermal tape to attach the device to the target surface. Also, calibrate the device according to the datasheet recommendations.
  • The maximum allowable voltage on the VCC pin is 3.6V. Exceeding this voltage may damage the device.
  • Yes, the device is designed to withstand high vibrations. However, ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress.
  • Check the SPI clock frequency, ensure correct pin connections, and verify the slave select signal. Also, use a logic analyzer or oscilloscope to debug the communication signals.

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