MM3Z24VST1G footprint, schematic symbol and 3D model by onsemi

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MM3Z24VST1G Details

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux.
Handle the device in an ESD-controlled environment. Use ESD-protective packaging and wrist straps or mats. Ground all equipment and tools to prevent static buildup.
Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures.

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Use the download button to access the MM3Z24VST1G schematic symbol, PCB footprint, and 3D model.

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