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MM3Z2V7T1G - onsemi

Description: Wide Zener Voltage Range Selection, 2.4V to 75V; VZ Tolerance Selection of ±5% (C Series); Very Small and Thin SMD package; Matte Tin(Sn) finish, Pb Free

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PCB Footprints
MM3Z2V7T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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MM3Z2V7T1G - onsemi  - 3D model - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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MM3Z2V7T1G Details

  • Manufacturer Part Number:

    MM3Z2V7T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    2.7 V

  • Reverse Current-Max:

    20 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    7.41%

  • Working Test Current:

    5 mA

MM3Z2V7T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern is recommended. The PCB should also have a solid ground plane to reduce thermal resistance.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Also, ensure that the device is not exposed to moisture or humidity.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may cause damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input pins to protect against electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Power up the device in the following sequence: VCC, then VIN. Ensure that VCC is stable before applying VIN. This sequence helps prevent latch-up and ensures reliable operation.

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MM3Z2V7T1G Overview

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