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MM3Z3V9ST1G - onsemi

Description: Standard Zener Breakdown Voltage Range - 2.4 V to 75 V; Steady State Power Rating of 300 mW; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics:; Tight Tolerance ; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; FLAMMABILITY RATING: UL94 V-0; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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MM3Z3V9ST1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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MM3Z3V9ST1G - onsemi  - 3D model - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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MM3Z3V9ST1G Details

  • Manufacturer Part Number:

    MM3Z3V9ST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    3.9 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    3.35%

  • Working Test Current:

    5 mA

MM3Z3V9ST1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND8033/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
  • The MM3Z3V9ST1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the MM3Z3V9ST1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, additional testing and validation may be required for specific applications.
  • The optimal input capacitor value depends on the input voltage, output current, and desired ripple voltage. A general guideline is to use a capacitor with a value between 1-10 μF, with a voltage rating of at least 1.5 times the input voltage. Consult the onsemi application note AND8033/D for more information.

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MM3Z3V9ST1G Overview

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