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MM5Z11VT5G - onsemi

Description: Standard Zener Breakdown Voltage Range: 2.4V to 75V; Steady State Power Rating of 500mW; Small Body Outline Dimensions: 0.047in x 0.032in (1.20mm x 0.80mm); Low Body Height: 0.028in (0.7mm); ESD Rating of Class 3 (>16kV) Human Body Model; Epoxy Meets UL94, VO; Cathode Indicated by Polarity Band; Lead Finish: 100% Matte Sn (Tin); Qualified Maximum Reflow Temperature: 260C; Device Meets MSL 1 Requirements; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other

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MM5Z11VT5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - MM5Z11VT5G
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MM5Z11VT5G - onsemi  - 3D model - Small Outline Diode Flat Lead - MM5Z11VT5G
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MM5Z11VT5G Details

  • Manufacturer Part Number:

    MM5Z11VT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523-2

  • Package Description:

    SOD-523, 2 PIN

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2018-08-30

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    20 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    160 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Voltage-Nom:

    11 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    9 mV/°C

  • Voltage Tol-Max:

    5.45%

  • Working Test Current:

    5 mA

MM5Z11VT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MM5Z11VT5G should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern around the device. A minimum of 2oz copper thickness is recommended. Additionally, placing vias under the device can help to dissipate heat more efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Proper heat sinking, such as using a heat sink or thermal interface material, can help to reduce the junction temperature. Additionally, derating the device's power dissipation at higher temperatures can help to prevent overheating.
  • The recommended soldering profile for the MM5Z11VT5G is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. A slow ramp-up and ramp-down rate of 1-2°C/s is recommended to prevent thermal shock. It's also essential to follow the onsemi recommended soldering guidelines and use a solder with a melting point above 217°C.
  • Yes, the MM5Z11VT5G can be used in a switching regulator application, but it's essential to ensure that the device is operated within its safe operating area (SOA). The device's maximum voltage and current ratings, as well as its thermal limitations, must be considered. Additionally, the switching frequency and duty cycle should be chosen to minimize power losses and ensure reliable operation.
  • To protect the MM5Z11VT5G from ESD, it's essential to follow proper handling and storage procedures. This includes using an ESD wrist strap or mat, storing the devices in anti-static packaging, and avoiding touching the device's pins. Additionally, incorporating ESD protection devices, such as TVS diodes or ESD arrays, in the circuit can help to protect the MM5Z11VT5G from ESD events.

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