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MMBD1701A - onsemi

Description: DIODE GEN PURP 30V 50MA SOT23-3

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Symbol
MMBD1701A - onsemi - PCB symbol
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PCB Footprints
MMBD1701A - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - BSR14
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3D Models
MMBD1701A - onsemi - 3D model - SOT23 (3-Pin) - BSR14
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MMBD1701A Details

  • Manufacturer Part Number:

    MMBD1701A

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G3

  • Non-rep Pk Forward Current-Max:

    0.25 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.05 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.35 W

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Recovery Time-Max:

    0.001 µs

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

MMBD1701A Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MMBD1701A is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, connect the base to a voltage source through a resistor (Rb) and a capacitor (Cb) in parallel. The recommended values are Rb = 1 kΩ and Cb = 10 nF. This helps to stabilize the base voltage and reduce noise.
  • For optimal thermal management, use a copper pour on the PCB to dissipate heat. Keep the component away from heat sources and ensure good airflow. Use a thermal pad or thermal interface material (TIM) to improve heat transfer between the device and the heat sink. A recommended PCB layout is to place the device near the edge of the board, with the heat sink on the opposite side.
  • To protect the MMBD1701A from ESD, handle the device with an anti-static wrist strap or mat. Use ESD-sensitive packaging and storage materials. When handling the device, touch a grounded object or wear an anti-static wrist strap to discharge any static electricity from your body.
  • The recommended soldering conditions for the MMBD1701A are: peak temperature = 260°C, time above 217°C = 10-15 seconds, and time above 183°C = 30-60 seconds. Use a solder with a melting point below 217°C to prevent damage to the device.

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MMBD1701A Overview

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