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MMBD301LT3G - onsemi

Description: Low Reverse Leakage - IR = 13 nAdc (Typ) MBD301, MMBD301; Very Low Capacitance - 1.5 pF (Max) @ VR = 15 V; Extremely Low Minority Carrier Lifetime - 15 ps (Typ); Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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PCB Footprints
MMBD301LT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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3D Models
MMBD301LT3G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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MMBD301LT3G Details

  • Manufacturer Part Number:

    MMBD301LT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    1.5 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • Frequency Band:

    ULTRA HIGH FREQUENCY

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMBD301LT3G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MMBD301LT3G is -55°C to 150°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and ensure that the device is operated within the recommended operating conditions. Additionally, consider using a radiation-hardened version of the device if it will be used in a high-radiation environment.
  • The maximum allowable power dissipation for the MMBD301LT3G is 1.5 W at 25°C. However, this value may be derated at higher temperatures.
  • To protect the MMBD301LT3G from ESD, handle the device in an ESD-controlled environment, use ESD-protective packaging and handling materials, and ensure that all personnel handling the device are grounded.
  • The recommended soldering temperature profile for the MMBD301LT3G is a peak temperature of 260°C for 10 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.

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MMBD301LT3G Overview

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For a full list of alternate parts for MMBD301LT3G, check out Findchips.com