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MMBD4448HAQW-TP - MCC

Description: Switching Diodes

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Symbol
MMBD4448HAQW-TP - MCC - PCB symbol
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PCB Footprints
MMBD4448HAQW-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363 (Thicknes 1.2mm)
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3D Models
MMBD4448HAQW-TP - MCC - 3D model - SOT23 (6-Pin) - SOT-363 (Thicknes 1.2mm)
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MMBD4448HAQW-TP Details

  • Manufacturer Part Number:

    MMBD4448HAQW-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-363, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.1

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    80 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

MMBD4448HAQW-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMBD4448HAQW-TP is a rectangular pad with a size of 0.8mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • While MMBD4448HAQW-TP is rated for operation up to 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. Prolonged exposure to high temperatures can affect the device's reliability and lifespan.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to handle MMBD4448HAQW-TP with ESD-safe materials, such as ESD-safe trays, tubes, or bags. Additionally, ensure that your production line and storage areas are ESD-protected.
  • The recommended soldering profile for MMBD4448HAQW-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's also recommended to use a solder with a melting point of 217°C or higher.
  • While MMBD4448HAQW-TP is not hermetically sealed, it's designed to operate in a normal humidity environment (RH < 60%). However, it's not recommended to use it in extremely humid environments (RH > 80%) or in applications where condensation is likely to occur.

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MMBD4448HAQW-TP Overview

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