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MMBF5103 - onsemi

Description: This device is designed for low level analog switching, sample andhold circuits and chopper stabilized amplifiers.; See J111 for characteristics.; Sourced from Process 51.

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PCB Footprints
MMBF5103 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 3L
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3D Models
MMBF5103 - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 3L
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MMBF5103 Details

  • Manufacturer Part Number:

    MMBF5103

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.82

  • Configuration:

    SINGLE

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.35 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MMBF5103 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the MMBF5103 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to keep the device within the recommended operating conditions to ensure reliable operation.
  • To ensure the MMBF5103 is properly biased for optimal performance, follow the recommended biasing conditions outlined in the datasheet, including the base-emitter voltage (VBE) and collector-emitter voltage (VCE). Additionally, consider the device's current gain (β) and ensure the base current is sufficient to maintain the desired collector current.
  • For optimal thermal management, ensure the MMBF5103 is mounted on a thermally conductive PCB material, and consider using thermal vias or a heat sink to dissipate heat. Keep the device away from other heat sources and ensure good airflow around the device. Follow standard PCB layout guidelines for high-frequency devices, including minimizing lead lengths and using a solid ground plane.
  • To handle ESD protection for the MMBF5103, follow standard ESD protection guidelines, including using ESD-sensitive handling procedures, storing the devices in anti-static packaging, and using ESD-protective workstations. Consider adding ESD protection devices, such as TVS diodes or ESD protection arrays, to the PCB design to protect the MMBF5103 from electrostatic discharge.
  • The reliability and lifespan expectations for the MMBF5103 are dependent on various factors, including operating conditions, environmental factors, and manufacturing quality. As a general guideline, the MMBF5103 is designed to meet the reliability standards outlined in the datasheet, including a typical lifespan of 10-15 years under normal operating conditions. However, actual lifespan may vary depending on the specific application and operating conditions.

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