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MMBF5462 - onsemi

Description: Obsolete - Small Signal JFET

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PCB Footprints
MMBF5462 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MMBF5462*
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3D Models
MMBF5462 - onsemi  - 3D model - SOT23 (3-Pin) - MMBF5462*
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MMBF5462 Details

  • Manufacturer Part Number:

    MMBF5462

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23-3

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318BM

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    2 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.225 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

MMBF5462 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the MMBF5462 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to keep the device within the recommended operating conditions to ensure reliable operation.
  • To ensure the MMBF5462 is properly biased for optimal performance, follow the recommended biasing conditions outlined in the datasheet, including the base-emitter voltage (VBE) and collector-emitter voltage (VCE). Additionally, ensure the device is operated within the recommended temperature range and that the power supply is stable and well-regulated.
  • For optimal thermal management, it's recommended to use a PCB layout that provides good thermal conductivity and heat dissipation. This can be achieved by using a thermal pad or heat sink, and ensuring good airflow around the device. The datasheet provides guidelines for thermal resistance and junction-to-ambient thermal resistance, which can be used to estimate the required thermal management.
  • To handle ESD protection for the MMBF5462, follow proper ESD handling procedures during device handling and assembly. This includes using ESD-safe materials, grounding straps, and ionizers to minimize static electricity. Additionally, consider using ESD protection devices, such as TVS diodes or ESD protection arrays, in the circuit design to protect the device from electrostatic discharge.
  • The reliability and lifespan expectations for the MMBF5462 are dependent on various factors, including operating conditions, temperature, and usage. The datasheet provides information on the device's reliability and lifespan under normal operating conditions. However, it's recommended to consult with onsemi's application notes and reliability reports for more detailed information.

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MMBF5462 Overview

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Part Image MMBF5462L99Z Fairchild Semiconductor Corporation

Small Signal Field-Effect Transistor, 1-Element, P-Channel, Silicon, Junction FET