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MMBFJ176 - onsemi

Description: ON Semiconductor MMBFJ176 P-Channel JFET, 15 V, Idss -2 → -25mA, 3-Pin SOT-23

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PCB Footprints
MMBFJ176 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318−08_1
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3D Models
MMBFJ176 - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318−08_1
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MMBFJ176 Details

  • Manufacturer Part Number:

    MMBFJ176

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

MMBFJ176 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the MMBFJ176 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to keep the device within the specified thermal limits to ensure reliable operation.
  • To ensure proper biasing, follow the recommended operating conditions and biasing schemes outlined in the datasheet. Additionally, consider the device's current gain (β) and Early voltage (VA) when designing the bias circuit. It's also important to ensure the device is operated within its specified voltage and current ratings.
  • For optimal thermal performance, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal interface material. Keep the device away from heat sources and ensure good airflow around the device. Follow standard PCB layout practices, such as using a solid ground plane and minimizing trace lengths, to reduce electromagnetic interference (EMI) and ensure signal integrity.
  • The MMBFJ176 has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent ESD damage. Use ESD-safe materials and equipment, and ensure that the device is properly grounded during handling and assembly. Additionally, consider adding external ESD protection devices, such as TVS diodes, to further protect the device from ESD events.
  • The MMBFJ176 is a high-reliability device with a typical lifespan of 10-20 years, depending on operating conditions and environmental factors. Follow proper storage, handling, and operating procedures to ensure the device meets its expected lifespan. Additionally, consider implementing reliability testing and monitoring to detect any potential issues early on.

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MMBFJ176 Overview

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Part Image MMBFJ176 Texas Instruments

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Part Image MMBFJ176 National Semiconductor Corporation

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Part Image MMBFJ176 EDI Diodes (Electronic Devices Inc)

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Part Image MMBFJ176_NL Fairchild Semiconductor Corporation

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