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MMBFJ177LT1G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life

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MMBFJ177LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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MMBFJ177LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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MMBFJ177LT1G Details

  • Manufacturer Part Number:

    MMBFJ177LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Configuration:

    SINGLE

  • Drain-source On Resistance-Max:

    300 Ω

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    5.5 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    CHOPPER

  • Transistor Element Material:

    SILICON

MMBFJ177LT1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MMBFJ177LT1G is -55°C to 150°C.
  • To ensure reliability, follow proper storage and handling procedures, use a clean and dry environment, and avoid exceeding the maximum ratings specified in the datasheet.
  • Use a PCB layout that minimizes thermal resistance, provides adequate heat sinking, and follows the recommended land pattern and thermal pad layout from the datasheet.
  • Yes, the MMBFJ177LT1G can be used in switching applications, but ensure that the switching frequency and voltage are within the recommended operating conditions.
  • Use proper ESD handling and storage procedures, such as using anti-static bags, wrist straps, and mats, and follow the recommended ESD protection guidelines.

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MMBFJ177LT1G Overview

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Part Image MMBFJ177_NL Fairchild Semiconductor Corporation

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Part Image MMBFJ177LT3 onsemi

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Part Image MMBFJ177D87Z Fairchild Semiconductor Corporation

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For a full list of alternate parts for MMBFJ177LT1G, check out Findchips.com