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MMBFU310LT1G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Pb-Free Package is Available

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MMBFU310LT1G - onsemi - PCB symbol
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PCB Footprints
MMBFU310LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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3D Models
MMBFU310LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AS
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MMBFU310LT1G Details

  • Manufacturer Part Number:

    MMBFU310LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    CASE 318-08, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.82

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    25 V

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    2.5 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.225 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

MMBFU310LT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-55°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • The MMBFU310LT1G has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the MMBFU310LT1G is suitable for high-reliability applications. It is manufactured using a high-reliability process, and it has undergone rigorous testing to ensure its reliability. However, it is still important to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • Use a systematic approach to troubleshoot issues with the MMBFU310LT1G. Check the power supply voltage, ensure that the device is properly soldered, and verify that the input and output signals are within the recommended operating range. Use oscilloscopes or logic analyzers to debug the circuit, and consult the datasheet and application notes for guidance.

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MMBFU310LT1G Overview

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MMBFU310LT1G Alternates

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Part Image MMBFU310LT1 onsemi

RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Junction FET, TO-236AB