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MMBT5089LT1G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
MMBT5089LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23
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3D Models
MMBT5089LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23
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MMBT5089LT1G Details

  • Manufacturer Part Number:

    MMBT5089LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.05 A

  • Collector-Emitter Voltage-Max:

    25 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    400

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.225 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

MMBT5089LT1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MMBT5089LT1G is -55°C to 150°C.
  • To ensure reliability, follow the recommended derating curves for power dissipation and junction temperature, and consider using a heat sink or thermal management system.
  • Use a pad design that allows for good thermal conduction and minimal thermal resistance. A recommended pad design is a thermal pad with a diameter of 1.5 mm to 2 mm, and a PCB layout that minimizes thermal resistance.
  • Use ESD protection devices, such as TVS diodes or ESD protection arrays, and follow proper handling and storage procedures to prevent ESD damage.
  • Use a soldering temperature of 260°C to 280°C, with a soldering time of 10 seconds to 30 seconds, and ensure that the component is not exposed to excessive thermal stress.

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MMBT5089LT1G Overview

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