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MMBZ27VALFHT116 - ROHM Semiconductor

Description: ESD Suppressors / TVS Diodes 225mW 25.65-28.35Vbr A-common SOT-23 TVS

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Symbol
MMBZ27VALFHT116 - ROHM Semiconductor - PCB symbol
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PCB Footprints
MMBZ27VALFHT116 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (SSD3)_1
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3D Models
MMBZ27VALFHT116 - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - SOT-23 (SSD3)_1
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MMBZ27VALFHT116 Details

  • Manufacturer Part Number:

    MMBZ27VALFHT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    28.35 V

  • Breakdown Voltage-Min:

    25.65 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    40 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    22 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMBZ27VALFHT116 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MMBZ27VALFHT116 is a rectangular pad with a size of 0.8mm x 1.2mm, with a solder mask opening of 0.6mm x 0.8mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The thermal resistance of the MMBZ27VALFHT116 is typically handled by ensuring good thermal conduction between the device and the PCB. This can be achieved by using a thermal via or a thermal pad under the device, and by using a thermal interface material (TIM) to fill any gaps between the device and the PCB.
  • The maximum operating temperature range for the MMBZ27VALFHT116 is -55°C to 150°C. However, the device is typically rated for operation up to 125°C for most applications.
  • To ensure the reliability of the MMBZ27VALFHT116 in high-reliability applications, it is recommended to follow the manufacturer's recommended assembly and soldering procedures, and to perform thorough testing and inspection of the device during the manufacturing process.
  • The equivalent series resistance (ESR) of the MMBZ27VALFHT116 is typically around 1.5 ohms. However, this value can vary depending on the specific application and operating conditions.

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MMBZ27VALFHT116 Overview

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