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MMBZ5227BW-TP - MCC

Description: Zener Diodes

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PCB Footprints
MMBZ5227BW-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323 (Thickness 1.2mm)
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3D Models
MMBZ5227BW-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-323 (Thickness 1.2mm)
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MMBZ5227BW-TP Details

  • Manufacturer Part Number:

    MMBZ5227BW-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    24 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1700 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    3.6 V

  • Reverse Current-Max:

    15 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20 mA

MMBZ5227BW-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMBZ5227BW-TP is a rectangular pad with a size of 0.5mm x 0.5mm, with a solder mask clearance of 0.1mm. It's also recommended to use a thermal pad with a size of 1.5mm x 1.5mm for better heat dissipation.
  • While the MMBZ5227BW-TP is rated for operation up to 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. Prolonged exposure to high temperatures can affect the device's reliability and lifespan.
  • To prevent electrostatic discharge (ESD) damage, it's essential to handle MMBZ5227BW-TP devices with care. Use an ESD wrist strap or mat, and ensure that your workspace is ESD-protected. Avoid touching the device's pins or leads, and use a vacuum pickup or tweezers to handle the device.
  • To maintain the device's reliability and performance, it's recommended to store MMBZ5227BW-TP devices in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the devices in direct sunlight or near sources of moisture.
  • While the MMBZ5227BW-TP is not hermetically sealed, it's designed to operate in a normal humidity environment. However, it's not recommended to use the device in high-humidity environments above 80% RH for extended periods, as this can affect the device's reliability and lifespan.

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MMBZ5227BW-TP Overview

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