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MMBZ5231B-TP - MCC

Description: Zener Diodes

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MMBZ5231B-TP - MCC - PCB symbol
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PCB Footprints
MMBZ5231B-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
MMBZ5231B-TP - MCC - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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MMBZ5231B-TP Details

  • Manufacturer Part Number:

    MMBZ5231B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    17 Ω

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20 mA

MMBZ5231B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the MMBZ5231B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent damage, handle the MMBZ5231B-TP by the body, avoiding touching the leads or the glass diode. Use anti-static wrist straps, mats, or tables to prevent electrostatic discharge (ESD) damage. Also, ensure that the assembly area is clean and free from debris.
  • The maximum allowable voltage that can be applied to the MMBZ5231B-TP is 200V, as specified in the datasheet. Exceeding this voltage may cause permanent damage to the component.
  • Store the MMBZ5231B-TP in its original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the component to extreme temperatures, humidity, or physical stress. Follow the storage guidelines outlined in the datasheet or in the Micro Commercial Components' application notes.
  • The MMBZ5231B-TP is rated for operation up to 150°C. However, it's essential to derate the component's power handling and voltage rating when operating at high temperatures. Consult the datasheet and application notes for specific guidance on high-temperature operation.

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MMBZ5231B-TP Overview

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MMBZ5231B-TP Alternates

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Part Image PMBZ5231BTRL13 NXP Semiconductors

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For a full list of alternate parts for MMBZ5231B-TP, check out Findchips.com