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MMBZ5252B-TP - MCC

Description: Zener Diodes

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PCB Footprints
MMBZ5252B-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
MMBZ5252B-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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MMBZ5252B-TP Details

  • Manufacturer Part Number:

    MMBZ5252B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    33 Ω

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    24 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    18 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5.2 mA

MMBZ5252B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for MMBZ5252B-TP can be found in the Micro Commercial Components' application note or in IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • To prevent damage, handle the MMBZ5252B-TP by the body, avoid touching the leads or the glass diode, and use an anti-static wrist strap or mat. Also, ensure that the assembly process is free from mechanical stress, and the component is not subjected to excessive heat or vibration.
  • The maximum allowable voltage for MMBZ5252B-TP is 50V, as specified in the datasheet. Exceeding this voltage may result in permanent damage to the component or affect its reliability.
  • The MMBZ5252B-TP is rated for operation up to 150°C. However, it's essential to derate the component's power handling capability according to the temperature derating curve provided in the datasheet to ensure reliable operation.
  • To ensure the reliability of MMBZ5252B-TP, follow the recommended operating conditions, derate the component according to the temperature derating curve, and ensure proper thermal management. Also, perform thorough testing and validation of your design to identify any potential issues.

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MMBZ5252B-TP Overview

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Part Image MMBZ5252B Sangdest Microelectronics (Nanjing) Co Ltd

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Part Image MMBZ5252B Silicon Standard Corp

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Part Image MMBZ5252B-HE3-08 Vishay Intertechnologies

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Part Image MMBZ5252B-T Micro Commercial Components

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