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MMBZ5V6ALYFHT116 - ROHM Semiconductor

Description: 3V, SOT-23, Dual Line, Anode Common, Automotive Transient Voltage Suppressor (AEC-Q101 Qualified)

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MMBZ5V6ALYFHT116 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (SSD3)_1
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MMBZ5V6ALYFHT116 - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - SOT-23 (SSD3)_1
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MMBZ5V6ALYFHT116 Details

  • Manufacturer Part Number:

    MMBZ5V6ALYFHT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2020-05-27

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    5.88 V

  • Breakdown Voltage-Min:

    5.32 V

  • Breakdown Voltage-Nom:

    5.6 V

  • Clamping Voltage-Max:

    8 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    24 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; MIL-STD-883

  • Rep Pk Reverse Voltage-Max:

    3 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMBZ5V6ALYFHT116 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MMBZ5V6ALYFHT116 can be found in the ROHM Semiconductor's package drawing document, which is usually available on their website. The document provides detailed information on the recommended pad layout, dimensions, and spacing for optimal soldering and assembly.
  • To prevent damage during assembly, it is recommended to handle the MMBZ5V6ALYFHT116 by the body or the tabs, avoiding touching the glass passivation layer or the metal pads. It is also recommended to use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
  • The maximum allowable power dissipation for the MMBZ5V6ALYFHT116 can be calculated using the thermal resistance and maximum junction temperature ratings provided in the datasheet. Typically, the maximum power dissipation is around 500-750 mW, but this value may vary depending on the specific application and operating conditions.
  • The MMBZ5V6ALYFHT116 is a commercial-grade device, but ROHM Semiconductor may offer a higher-reliability or automotive-grade version of the device with additional testing and qualification. It is recommended to contact ROHM Semiconductor directly to inquire about the availability and specifications of such devices.
  • The optimal bias voltage for the MMBZ5V6ALYFHT116 depends on the specific application and operating conditions. Typically, the recommended bias voltage is around 5-6 V, but it may need to be adjusted based on the desired breakdown voltage, leakage current, and other performance characteristics. It is recommended to consult the datasheet and application notes for more information.

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