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MMBZ6V8ALT116 - ROHM Semiconductor

Description: ESD Suppressors / TVS Diodes MMBZ6V8AL is TVS Diode for ESD protection.

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Symbol
MMBZ6V8ALT116 - ROHM Semiconductor - PCB symbol
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PCB Footprints
MMBZ6V8ALT116 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - (SOT-23 SSD3)
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3D Models
MMBZ6V8ALT116 - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - (SOT-23 SSD3)
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MMBZ6V8ALT116 Details

  • Manufacturer Part Number:

    MMBZ6V8ALT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    7.14 V

  • Breakdown Voltage-Min:

    6.46 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    40 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMBZ6V8ALT116 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MMBZ6V8ALT116 is a rectangular pad with a size of 0.8mm x 1.6mm, with a solder mask opening of 0.6mm x 1.4mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The MMBZ6V8ALT116 has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating by keeping the operating temperature below 125°C.
  • The maximum allowable power dissipation for the MMBZ6V8ALT116 is 500mW. Ensure that the device is operated within this power rating to prevent overheating and damage.
  • Yes, the MMBZ6V8ALT116 is suitable for high-frequency applications up to 1GHz. However, ensure that the device is properly decoupled and that the PCB layout is optimized for high-frequency operation.
  • To ensure the reliability of the MMBZ6V8ALT116 in a humid environment, ensure that the device is stored and operated in a dry environment, and consider using a moisture-resistant coating or conformal coating to protect the device from moisture.

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MMBZ6V8ALT116 Overview

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