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MMBZ6V8ALYT116 - ROHM Semiconductor

Description: 4.5V, SOT-23, Dual Line, Anode Common Transient Voltage Suppressor

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MMBZ6V8ALYT116 - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - (SOT-23 SSD3)
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MMBZ6V8ALYT116 - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - (SOT-23 SSD3)
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MMBZ6V8ALYT116 Details

  • Manufacturer Part Number:

    MMBZ6V8ALYT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2020-05-27

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    7.14 V

  • Breakdown Voltage-Min:

    6.46 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Clamping Voltage-Max:

    9.6 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    24 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    IEC-61000-4-2; MIL-STD-883

  • Rep Pk Reverse Voltage-Max:

    4.5 V

  • Reverse Current-Max:

    0.3 µA

  • Reverse Test Voltage:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMBZ6V8ALYT116 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MMBZ6V8ALYT116 is a rectangular pad with a size of 0.8mm x 1.6mm, with a solder mask opening of 0.6mm x 1.4mm.
  • To handle the ESD sensitivity of the MMBZ6V8ALYT116, it is recommended to use an ESD protection device, such as a TVS diode, in parallel with the Zener diode. Additionally, follow proper ESD handling procedures during assembly and storage.
  • The maximum allowable power dissipation for the MMBZ6V8ALYT116 is 500mW. It is recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the device.
  • Yes, the MMBZ6V8ALYT116 is suitable for high-reliability applications. ROHM Semiconductor provides a high-reliability version of the device, which undergoes additional screening and testing to ensure its reliability in harsh environments.
  • To ensure proper soldering of the MMBZ6V8ALYT116, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. Use a soldering time of 2-3 seconds, and avoid applying excessive force or vibration during the soldering process.

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MMBZ6V8ALYT116 Overview

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