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MMDF1N05ER2G - onsemi

Description: Obsolete - Power MOSFET 30V 4.1 A 70 mOhm Dual Complementary SO-8

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MMDF1N05ER2G - onsemi - PCB symbol
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PCB Footprints
MMDF1N05ER2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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3D Models
MMDF1N05ER2G - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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MMDF1N05ER2G Details

  • Manufacturer Part Number:

    MMDF1N05ER2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    300 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    50 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MMDF1N05ER2G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MMDF1N05ER2G is -55°C to 150°C.
  • To ensure reliability, follow the recommended assembly and soldering guidelines, and ensure that the device is operated within the specified voltage and current ratings. Additionally, consider using a thermal management strategy to keep the device within its recommended operating temperature range.
  • The recommended PCB layout for the MMDF1N05ER2G involves using a thermal pad and thermal vias to dissipate heat. A heat sink or thermal interface material can also be used to improve thermal performance. Consult the onsemi application note for more detailed guidance.
  • To prevent ESD damage, handle the MMDF1N05ER2G with ESD-protective equipment, such as wrist straps and mats. Ensure that the device is stored in an ESD-protective package, and follow proper handling and assembly procedures.
  • Consult the onsemi application note for recommended test and measurement procedures, including setup and calibration guidelines for test equipment. Ensure that the device is tested within its specified voltage and current ratings.

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MMDF1N05ER2G Overview

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