MMDL770T1G footprint, schematic symbol and 3D model by onsemi

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MMDL770T1G - onsemi PCB footprint - Other - Other - MMDL770T1G-2

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Part Number MMDL770T1G
Manufacturer onsemi
Pin Count 2
Part Category Diode
Package Category Other
Footprint Name Other - MMDL770T1G-2
Released Date Jan 28, 2020
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

MMDL770T1G Details

Manufacturer Part Number:
MMDL770T1G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOD-323 2 LEAD
Package Description:
LEAD FREE, PLASTIC, CASE 477-02, 2 PIN
Pin Count:
2
Manufacturer Package Code:
477-02
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.60
Manufacturer:
onsemi
YTEOL:
5
Configuration:
SINGLE
Diode Capacitance-Max:
1 pF
Diode Element Material:
SILICON
Diode Type:
MIXER DIODE
Forward Voltage-Max (VF):
1 V
Frequency Band:
VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 Code:
R-PDSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Power Dissipation-Max:
0.2 W
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
70 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30

MMDL770T1G Frequently Asked Questions (FAQs)

A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid overheating the device, as it can lead to reduced reliability and lifespan.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
Use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input lines to minimize EMI. Ensure that the PCB layout is designed to minimize radiation and conduction of EMI.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.

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