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MMPF0100F0AEP - NXP

Description: Power Management Specialized - PMIC PFUZE100

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Symbol
MMPF0100F0AEP - NXP - PCB symbol
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PCB Footprints
MMPF0100F0AEP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MMPF0100F0AEP
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3D Models
MMPF0100F0AEP - NXP - 3D model - Quad Flat No-Lead - MMPF0100F0AEP
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MMPF0100F0AEP Details

  • Manufacturer Part Number:

    MMPF0100F0AEP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-56

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MMPF0100F0AEP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power traces short and wide, and use a common ground point for all components.
  • Follow the power-up sequence outlined in the datasheet, and ensure that the EN pin is properly configured. Also, make sure to connect the VDD pin to a stable power source.
  • The MMPF0100F0AEP has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink if the device will be operating at high temperatures or high currents.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply voltage, clock signals, and data lines for any anomalies. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, follow proper EMI/EMC design practices, such as using a shielded enclosure, minimizing loop areas, and using EMI filters. Ensure that the device is properly decoupled and that the PCB layout is optimized for EMI reduction.

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MMPF0100F0AEP Overview

Use the download button to access the MMPF0100F0AEP schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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