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MMPF0100F1AEP - NXP

Description: Power Management IC for IMX6, 6 Buck + Boost + 7 LDO, Industrial , 2.8V ~ 4.5V , -40°C ~ 85°C (TA)

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Symbol
MMPF0100F1AEP - NXP - PCB symbol
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PCB Footprints
MMPF0100F1AEP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT684-16
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3D Models
MMPF0100F1AEP - NXP - 3D model - Quad Flat No-Lead - SOT684-16
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MMPF0100F1AEP Details

  • Manufacturer Part Number:

    MMPF0100F1AEP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-56

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MMPF0100F1AEP Frequently Asked Questions (FAQs)

  • A good PCB layout for the MMPF0100F1AEP involves placing the device close to the power source, using a solid ground plane, and minimizing the length of the power traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To optimize the performance of the MMPF0100F1AEP in a high-temperature environment, ensure good thermal design, use a heat sink if necessary, and consider using a thermal interface material. Also, reduce the power consumption and adjust the operating frequency to minimize heat generation.
  • To minimize EMI, use a shielded enclosure, keep the power traces short and away from sensitive signals, and use a common-mode choke or ferrite bead on the power lines. Also, ensure good grounding and use a low-pass filter on the output.
  • To troubleshoot issues with the MMPF0100F1AEP, start by checking the power supply voltage, ensuring it's within the recommended range. Then, verify the input and output voltages, and check for any signs of overheating. Use an oscilloscope to check for noise or oscillations on the output.
  • Thermal design considerations for the MMPF0100F1AEP include ensuring good airflow, using a heat sink if necessary, and keeping the device away from other heat sources. Also, consider using a thermal interface material and ensure the PCB is designed for good thermal conductivity.

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MMPF0100F1AEP Overview

Use the download button to access the MMPF0100F1AEP schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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