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MMPF0100NPAEP - NXP

Description: NXP - MMPF0100NPAEP - POWER MANAGEMENT IC, 14-CH, HQFN-56

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Symbol
MMPF0100NPAEP - NXP - PCB symbol
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PCB Footprints
MMPF0100NPAEP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN8X8X0.5_56
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3D Models
MMPF0100NPAEP - NXP - 3D model - Quad Flat No-Lead - QFN8X8X0.5_56
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MMPF0100NPAEP Details

  • Manufacturer Part Number:

    MMPF0100NPAEP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-56

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e4

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MMPF0100NPAEP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power traces short and wide, and use a common ground point for all components.
  • Use a soft-start circuit to ramp up the voltage supply to the MMPF0100NPAEP during power-on, and use a power-good signal to monitor the output voltage. During power-off, ensure a gradual shutdown to prevent damage to the device.
  • The MMPF0100NPAEP has a high power density, so thermal management is crucial. Use a heat sink with a thermal interface material, and ensure good airflow around the device. Monitor the junction temperature and adjust the thermal design accordingly.
  • Use a systematic approach to troubleshoot issues. Check the power supply, clock signals, and output voltage. Use an oscilloscope to monitor the waveforms and identify any anomalies. Consult the datasheet and application notes for guidance.
  • Use a shielded enclosure and ensure good grounding practices to minimize EMI. Use a common-mode choke and a ferrite bead to filter the output voltage. Follow the guidelines in the datasheet and application notes for EMI and EMC compliance.

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MMPF0100NPAEP Overview

Use the download button to access the MMPF0100NPAEP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MMPF0, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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