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MMQA18VT1G - onsemi

Description: Small Package Size for High Density Applications; FINISH:Corrosion Resistant Finish, Easily Solderable; Package Designed for Optimal Automated Board Assembly; Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace with "T3" in the Device Number to order the 13 inch/10,000 unit reel.; Low Leakage < 2.0 mA; SC-59 Package Allows Four Separate Unidirectional Configurations; CASE:Void Free, Transfer-Molded, Thermosetting Plastic Case; Peak Power - Min. 24 W @ 1.0 ms (U

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PCB Footprints
MMQA18VT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-74 CASE 318F-05
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3D Models
MMQA18VT1G - onsemi  - 3D model - SOT23 (6-Pin) - SC-74 CASE 318F-05
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MMQA18VT1G Details

  • Manufacturer Part Number:

    MMQA18VT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74 (SC-59ML) 6 LEAD

  • Package Description:

    SC-74, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Breakdown Voltage-Max:

    18.9 V

  • Breakdown Voltage-Min:

    17.1 V

  • Breakdown Voltage-Nom:

    18 V

  • Clamping Voltage-Max:

    26 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    150 W

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    14 V

  • Reverse Current-Max:

    0.075 µA

  • Reverse Test Voltage:

    14 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMQA18VT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots. Monitor junction temperature and adjust the system design accordingly.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C. The recommended soldering time is 30-60 seconds. Ensure the device is handled by trained personnel to prevent damage.
  • Use an ESD wrist strap or mat, and ensure all equipment is grounded. Handle the device by the body or leads, avoiding direct contact with the die. Use ESD-protective packaging and storage materials.
  • Operating the device beyond the recommended voltage range can lead to reduced reliability, increased leakage current, and potential device failure. Ensure the device is operated within the specified voltage range to maintain optimal performance and reliability.

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MMQA18VT1G Overview

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