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MMST3906-7-F - Diodes Incorporated

Description: Bipolar (BJT) Transistor PNP 40 V 200 mA 300MHz 200 mW Surface Mount SOT-323

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PCB Footprints
MMST3906-7-F - Diodes Incorporated PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323
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3D Models
MMST3906-7-F - Diodes Incorporated  - 3D model - SOT23 (3-Pin) - SOT-323
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MMST3906-7-F Details

  • Manufacturer Part Number:

    MMST3906-7-F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

  • Turn-off Time-Max (toff):

    300 ns

  • Turn-on Time-Max (ton):

    70 ns

MMST3906-7-F Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for heat dissipation. A copper pour on the PCB with multiple vias to a solid ground plane can help to reduce thermal resistance.
  • Ensure the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C. Implement proper thermal management, and consider using a heat sink or thermal interface material if necessary.
  • Handle the device with ESD-protective equipment and follow standard ESD handling procedures. The device has built-in ESD protection, but it's not a substitute for proper handling and storage precautions.
  • The MMST3906-7-F is an industrial-grade device, but it's not specifically designed for high-reliability or automotive applications. For such applications, consider using devices with specific automotive or high-reliability certifications.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s max. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.

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MMST3906-7-F Overview

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For a full list of alternate parts for MMST3906-7-F, check out Findchips.com