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MMSTA42-7-F - Diodes Incorporated

Description: TRANSISTOR

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MMSTA42-7-F - Diodes Incorporated - PCB symbol
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PCB Footprints
MMSTA42-7-F - Diodes Incorporated PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323
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3D Models
MMSTA42-7-F - Diodes Incorporated - 3D model - SOT23 (3-Pin) - SOT-323
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MMSTA42-7-F Details

  • Manufacturer Part Number:

    MMSTA42-7-F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, ULTRA SMALL, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    300 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    40

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

MMSTA42-7-F Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal copper plane or the backside of the PCB.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Also, consider derating the device's current handling capability at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. The device is also compatible with wave soldering and hand soldering.
  • Handle the device with an anti-static wrist strap or mat. Use ESD-protected packaging and storage materials. Ground all equipment and tools before handling the device.
  • Store the device in a dry, cool place (below 30°C and 60% relative humidity). Avoid exposure to direct sunlight, moisture, and contaminants.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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This model has been reviewed by community users.
Community Approved
Sponsored

MMSTA42-7-F Overview

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For a full list of alternate parts for MMSTA42-7-F, check out Findchips.com