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MMSTA92-TP - MCC

Description: Small Signal Bipolar Transistors

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PCB Footprints
MMSTA92-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-323 (Thickness 1.2mm)
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3D Models
MMSTA92-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-323 (Thickness 1.2mm)
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MMSTA92-TP Details

  • Manufacturer Part Number:

    MMSTA92-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, ULTRA SMALL, PLASTIC, PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    300 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    40

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

MMSTA92-TP Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, with thermal vias connecting to the top layer under the MMSTA92-TP package. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its specified operating temperature range.
  • The recommended soldering conditions for MMSTA92-TP are: peak temperature of 260°C, soldering time of 10-15 seconds, and a soldering iron temperature of 350-370°C. It's also important to use a solder with a melting point above 217°C.
  • Yes, MMSTA92-TP can be used in a switching regulator application, but it's essential to ensure that the device is operated within its specified SOA (Safe Operating Area) and that the switching frequency is within the recommended range to avoid overheating and reliability issues.
  • To handle ESD protection when handling MMSTA92-TP devices, it's recommended to use an ESD wrist strap or mat, and to handle the devices by the body or leads, rather than the pins. It's also important to store the devices in anti-static packaging and to follow proper ESD handling procedures.

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MMSTA92-TP Overview

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