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MMSZ13T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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PCB Footprints
MMSZ13T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ13T1G - onsemi  - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ13T1G Details

  • Manufacturer Part Number:

    MMSZ13T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    30 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    170 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    13 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    11 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

MMSZ13T1G Frequently Asked Questions (FAQs)

  • The recommended footprint for the MMSZ13T1G is a standard SOD-123 package with a pad size of 0.8mm x 1.6mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid overheating the component.
  • The maximum allowable power dissipation for the MMSZ13T1G is 500mW. Exceeding this limit may cause the component to fail.
  • The MMSZ13T1G is rated for operation up to 150°C. However, it's recommended to derate the power dissipation by 50% for every 10°C above 50°C to ensure reliability.
  • To prevent electrostatic discharge (ESD) damage, use an ESD wrist strap or mat, and handle the component by the body or leads, avoiding direct contact with the die.

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MMSZ13T1G Overview

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Zener Diode, 13V V(Z), 5%, 0.5W, Silicon, Unidirectional